All InnoLas wafer marking systems are capable of marking multible codetypes such as OCR, T7 Data Matrix, Barcode 412 and Engrave Mode. All fonts conform to the SEMI standard and are readable by common character recognition systems.
There are several InnoLas developed laser beam sources available to assure ideal results for all semiconductor material types.
With the soft laser marking process, the material is melted by the laser radiation. In this case a shallow debris free mark from one to five micron depth will be created. This type of mark is common for polished wafer surfaces mostly used at chip but also at wafer suppliers.